Abstract: When calculating pad coordinates, there is often confusion between die size specified in the data sheet and the physical die size after it is cut from the wafer. The physical edge of the die is not a good reference for wire bonding because of slight inconsistencies of overall die dimensions. This application note will briefly discuss die dimensions, die orientation, bonding coordinates, and how to calculate the physical die size. The MAX3970 will be used as an example. The application note you have requested is available in Acrobat PDF format: APPLICATION NOTE 630: HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size (PDF, 91kB) A free Acrobat PDF reader is available from: http://www.adobe.com/products/acrobat/readstep.html We Want Your Feedback! Automatic Updates Would you like to be automatically notified when new application notes are published in your areas of interest? Sign up for EE-Mail™. More Information   APP 630: Aug 06, 2001 MAX3266 1.25Gbps/2.5Gbps, +3V to +5.5V, Low-Noise Transimpedance Preamplifiers for LANs Full Data Sheet (PDF, 912kB) MAX3267 1.25Gbps/2.5Gbps, +3V to +5.5V, Low-Noise Transimpedance Preamplifiers for LANs Full Data Sheet (PDF, 912kB) MAX3271 +3.3V, 2.5Gbps Low-Power Transimpedance Amplifier Full Data Sheet (PDF, 268kB) MAX3275 Low-Noise, Fibre Channel Transimpedance Amplifiers Full Data Sheet (PDF, 1.3MB) MAX3277 Low-Noise, Fibre Channel Transimpedance Amplifiers Full Data Sheet (PDF, 1.3MB) MAX3864 2.5Gbps, +3V to +5.5V, Wide Dynamic Range Transimpedance Preamplifier Full Data Sheet (PDF, 308kB) MAX3910 10.7Gbps Linear Transimpedance Amplifier with Output Offset Adjust Full Data Sheet (PDF, 200kB) MAX3970 10Gbps, 3.3V Low-Power Transimpedance Amplifier with RSSI Full Data Sheet (PDF, 492kB)   Download, PDF Format (91kB)  AN630, AN 630, APP630, Appnote630, Appnote 630