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Maxim >
Company >
Process Technologies and Wafer Fab
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BiCMOS
| Innovative Process Characteristics |
- Devices with voltage ratings of 3.3 to 30 volts such as 0.35-µm logic, precision high voltage analog, and EEPROM and Flash are integrated on a single silicon chip.
- Fully isolated CMOS and bipolar architecture to minimize noise on mixed-mode circuit designs, allowing integration of dense logic and high-precision analog on the same die.
- Precision analog components such as bipolar transistors and laser-trimmable thin-film resistors allow highly accurate analog circuits, such as references with accuracies better than 0.5%.
- Highest density, highest resistivity thin-film resistors allow for the lowest quiescent current products.
- No competitor matches the diversity of features Maxim has in its BiCMOS process. For example, we combine high-voltage components, thin-film resistors, capacitors, Non volatile memories, and bipolar transistors all on the same substrate.
- Thick copper metallization with low K dielectric allows integration of high current transistors for power management applications.
- Post package trim for the highest level of accuracy.
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| Applications |
- Multi-function power management for Cell Phones and PDAs.
- Multi-voltage power management
- Automotive power management devices
- Smart battery packs
- Voltage regulators for telecom and data communication cards.
- Precision A/D converters for medical applications
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